Academia Sinica | Semiconductor Equipment Model

Explaining Semiconductor Processes

Academia Sinica worked with Maxmodel on a semiconductor process-layout model covering wafer production from design to final packaging. It presents the key machines and equipment required at each stage, using 3D printing and experienced paint finishing to reproduce their appearance.

Detailed Equipment at Display Scale

The design team used fine 3D-printed details to give the model a carefully finished appearance. Measuring 150 cm long and 100 cm wide, it provides a display that several visitors can view and discuss together.

Sharing Research and Technology

The original case report describes the model on display at Academia Sinica's Southern Campus, giving guests an opportunity to understand semiconductor processing. It supports the institute's presentation of its semiconductor research and efforts to share technical knowledge.